6.4 Thermal Information

THERMAL METRIC(1)

Legacy Chip

New Chip

UNIT

DBV (SOT-23)

DBV (SOT-23)

5 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

213.1

170.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

110.9

68.7

°C/W

RθJB

Junction-to-board thermal resistance

97.4

76.7

°C/W

ψJT

Junction-to-top characterization parameter

22.0

10.3

°C/W

ψJB

Junction-to-board characterization parameter

78.4

76.3

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application

report.

TLV704

SBVS148E – SEPTEMBER 2010 – REVISED DECEMBER 2022

www.ti.com

6

Submit Document Feedback

Copyright © 2022 Texas Instruments Incorporated

Product Folder Links: TLV704