Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Pin Configuration and Functions...................................4

6 Specifications.................................................................. 5

6.1 Absolute Maximum Ratings........................................ 5

6.2 ESD Ratings............................................................... 5

6.3 Recommended Operating Conditions.........................5

6.4 Thermal Information....................................................6

6.5 Electrical Characteristics.............................................7

6.6 Typical Characteristics................................................ 8

7 Detailed Description......................................................13

7.1 Overview................................................................... 13

7.2 Functional Block Diagram......................................... 13

7.3 Feature Description...................................................13

7.4 Device Functional Modes..........................................15

8 Application and Implementation.................................. 16

8.1 Application Information............................................. 16

8.2 Typical Application.................................................... 16

8.3 Best Design Practices...............................................18

8.4 Power Supply Recommendations.............................19

8.5 Layout....................................................................... 19

9 Device and Documentation Support............................20

9.1 Device Support......................................................... 20

9.2 Documentation Support............................................ 20

9.3 Receiving Notification of Documentation Updates....20

9.4 Support Resources................................................... 20

9.5 Trademarks...............................................................20

9.6 Electrostatic Discharge Caution................................20

9.7 Glossary....................................................................20

10 Mechanical, Packaging, and Orderable

Information.................................................................... 21

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision D (January 2015) to Revision E (December 2022)

Page

• Changed document title, Features, Applications, and Description sections and added M3 device information

to document........................................................................................................................................................ 1

• Changed Pin Configuration and Functions section.............................................................................................4

• Added new chip specific curves to Typical Characteristics section.................................................................... 8

• Changed Overview section...............................................................................................................................13

• Changed Functional Block Diagram image...................................................................................................... 13

• Changed Feature Description section.............................................................................................................. 13

• Deleted thermal shutdown discussion from Current Limit section.................................................................... 14

• Changed Normal Operation section................................................................................................................. 15

• Changed Dropout Operation section................................................................................................................ 15

• Changed Application Information section......................................................................................................... 16

• Added External Capacitor Requirements, Reverse Current, and Power Dissipation sub-sections to Detailed

Design Procedure section.................................................................................................................................16

• Changed Input and Output Capacitor Requirements section........................................................................... 16

• Added Reverse Current section........................................................................................................................17

• Changed Estimating Junction Temperature section......................................................................................... 18

• Added Best Design Practices section...............................................................................................................18

• Changed Power Supply Recommendations section.........................................................................................19

• Changed Layout Guidelines section................................................................................................................. 19

• Changed Power Dissipation section: changed title and deleted last sentence from section............................ 19

• Added M3 row to Available Options table.........................................................................................................20

TLV704

SBVS148E – SEPTEMBER 2010 – REVISED DECEMBER 2022

www.ti.com

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