Copyright

© ANPEC Electronics Corp.

Rev. A.4 - May., 2005

APL5913

www.anpec.com.tw

4

Absolute Maximum Ratings

Thermal Characteristics

Recommended Operating Conditions

Symbol

Parameter

Rating

Unit

VCNTL Supply Voltage (VCNTL to GND)

-0.3 ~ 7

V

VIN Supply Voltage (VIN to GND)

-0.3 ~ 3.3

V

EN and FB to GND

V

POK to GND

-0.3 ~ 7

V

Average Power Dissipation

3

W

Peak Power Dissipation (<20mS)

20

W

Junction Temperature

150

Storage Temperature

-65 ~ 150

Soldering Temperature, 10 Seconds

300

Minimum ESD Rating (Human Body Mode)

±2

kV

Symbol

Parameter

Value

Unit

Junction-to-Ambient Thermal Resistance in Free Air (Note)

40

Note :

board in free air. The exposed pad of SOP-8-P is soldered directly on the PCB.

Symbol

Parameter

Range

Unit

VCNTL Supply Voltage

3.1 ~ 6

V

VIN Supply Voltage

1.1 ~ 3.3

V

Output Voltage

±5%

±5%

0.8 ~ 1.2

0.8 ~ VIN-0.2

V

VOUT Output Current

0 ~ 4

A

Junction Temperature

-25 ~ 125

Electrical Characteristics

APL5913

Symbol

Parameter

Test Conditions

Min

Typ

Max

Unit

SUPPLY CURRENT

VCNTL Nominal Supply Current

EN = VCNTL

0.4

1

8

mA

VCNTL Shuntdown Current

EN = GND

180

300

µA

to 70