www.sensirion.com / D1

Version 4

– November 2022

14/22

5 Physical Specification

5.1 Package Description

SHT4x is provided in an open-cavity dual flat no lead (DFN) package. The humidity sensor opening

is centered on the top side of the package. The sensor chip is made of silicon, hosted on a copper

lead frame and overmolded by an epoxy-based mold compound. Exposed bottom side of the

leadframe with the metallic contacts is Ni/Pd/Au coated, side walls are bare copper.

Moisture sensitivity level (MSL) of one according to IPC/JEDEC J-STD-020 is achieved. It is

recommended to process the sensors within one year after date of delivery.

5.2 Package Outline

Figure 15. Dimensional drawing of SHT4x including package tolerances (units mm).

Figure 16. Dimensional drawing of SHT4xI with filter membrane including package tolerances (units mm)