AP66300

Document number: DS43722 Rev. 2 - 2

22 of 25

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August 2022

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AP66300

Layout

PCB Layout

1.

The AP66300 is a high switching frequency converter. Hence, attention must be paid to the switching currents interference in the layout.

Switching current from one power device to another can generate voltage transients across the impedances of the interconnecting bond

wires and circuit traces. These interconnecting impedances should be minimized by using wide, short printed circuit traces. The AP66300

works at 3A load current so heat dissipation is a major concern in the layout of the PCB. 2oz copper for both the top and bottom layers is

recommended.

2.

Place the input capacitors as closely across VIN and GND as possible.

3.

Place the inductor as close to SW as possible.

4.

Place the output capacitors as close to GND as possible.

5.

Place the feedback components as close to FB as possible.

6.

If using four or more layers, use at least the 2nd and 3rd layers as GND to maximize thermal performance.

7.

Add as many vias as possible around both the GND pin and under the GND plane for heat dissipation to all the GND layers.

8.

Add as many vias as possible around both the VIN pin and under the VIN plane for heat dissipation to all the VIN layers.

9.

See Figure 47 for more details.

PGND

7

8

10

11

1

2

3

5

VIN

VCC

BIAS

FS

12

9

4

6

13

14

15

16

EN

EPAD

MSYNC

VIN

C5

C4

R1

R2

VIN

VOUT

SW

PGND

Figure 47. PC Board Layout