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PACKAGE OUTLINE

C

5.15

4.85

5.15

4.85

0.8

0.7

0.05

0.00

2X 3.6

36X 0.4

2X 3.6

40X

0.5

0.3

40X

0.25

0.15

3.5 0.1

(0.2) TYP

WQFN - 0.8 mm max height

RSB0040B

PLASTIC QUAD FLATPACK - NO LEAD

4219094/A 11/2018

0.08 C

0.1

C A B

0.05

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

PIN 1 INDEX AREA

SEATING PLANE

PIN 1 ID

SYMM

EXPOSED

THERMAL PAD

SYMM

1

10

11

20

21

30

31

40

41

SCALE 3.000

A

B

CC3301, CC3300

SWRS310 – MARCH 2023

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