www.ti.com

EXAMPLE BOARD LAYOUT

36X (0.4)

(R0.05) TYP

0.05 MAX

ALL AROUND

0.05 MIN

ALL AROUND

40X (0.6)

40X (0.2)

(4.8)

(4.8)

(

3.5)

(

0.2) TYP

VIA

(0.6) TYP

(0.9) TYP

(0.6) TYP

(0.9) TYP

WQFN - 0.8 mm max height

RSB0040B

PLASTIC QUAD FLATPACK - NO LEAD

4219094/A 11/2018

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

SYMM

SYMM

EXPOSED METAL SHOWN

LAND PATTERN EXAMPLE

SCALE: 20X

SEE SOLDER MASK

DETAIL

1

10

11

20

21

30

31

40

41

METAL EDGE

SOLDER MASK

OPENING

EXPOSED METAL

METAL UNDER

SOLDER MASK

SOLDER MASK

OPENING

EXPOSED

METAL

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DEFINED

SOLDER MASK DETAILS

www.ti.com

CC3301, CC3300

SWRS310 – MARCH 2023

Copyright © 2023 Texas Instruments Incorporated

Submit Document Feedback

7

Product Folder Links: CC3301 CC3300