EXAMPLE STENCIL DESIGN

4226301/D 11/2022

www.ti.com

WQFN-FCRLF - 0.7 mm max height

RXX0037A

PLASTIC QUAD FLAT PACK- NO LEAD

SOLDER PASTE EXAMPLE

BASED ON 0.1 mm THICK STENCIL

SOLDER COVERAGE :

Thermal Pad connected to pin 7-10, 19 : 80%

Thermal Pad connected to pin 20-24 : 86%

SCALE: 15X

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

(R 0.05) TYP

32X (0.5)

2X (3.5)

0.000 PKG ℄

(3.2)

(2.09)

(2.9)

2X (4.5)

10X (0.45)

18X (0.6)

(2.8)

(2.6)

2X (1.547)

(1.347)

(0.187)

(0.155)

2X (1.318)

(1.438)

2X (1.05)

(1.17)

(1.47)

2X (0.96)

(1.47)

(0.84)

3X (1)

2X (1.55)

2X (1.71)

1

6

10

11

19

25

28

29

36

37

18

7

20

24

(1.2)

37X (0.25)

2X (1)