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MAX22196 Datasheet(PDF) 52 Page - Analog Devices

Part # MAX22196
Description  Octal Industrial Sink/Source Digital Input
PDF  61 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

MAX22196 Datasheet(HTML) 52 Page - Analog Devices

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MAX22196
Octal Industrial Sink/Source
Digital Input
www.analog.com
Analog Devices | 52
Applications Information
Power Supply Sequencing
The MAX22196 does not require special power supply sequencing. The logic interface supply (VL) is set independently
from the field supply (V24) or LDO output (VA) levels.
Power Supply Decoupling
To reduce ripple and the chance of introducing data errors, bypass V24 and VA with 1μF ceramic capacitors to GND and
bypass VL with 0.1μF ceramic capacitor to GND, respectively. Place the bypass capacitors as close as possible to the
power supply input pins.
PCB Layout Recommendations
The PCB designer should follow some critical recommendations in order to get the best performance from the design.
• Keep the input/output traces as short as possible. To keep signal paths low-inductance, avoid using vias.
• Have a solid ground plane underneath the entire EP area with multiple thermal vias for best thermal performance.
• Maximize the metal coverage for all layers, especially for top and bottom layer to optimize the heat dissipation.
• Use 2oz copper for top and bottom layer if possible so that more heat can be drawn to the PCB.
• Maximize the number of vias under the package for thermal purposes. If possible, fill the via with copper, which further
enhances the vertical heat transfer through the PCB.
Powering VA Supply Externally
The VA pin can alternatively be powered by an external 3V to 5.5V supply. In this configuration, disable the on-chip
regulator by connecting REGEN pin to GND. This configuration reduces the power dissipation in the chip by 1.3mA x (V24
- 5V), typical. When powering the MAX22196 from an external 3.3V or 5V supply on VA, V24 must be powered by external
24V supply for source configurations. If the MAX22196 is only operated in sink or TTL configurations, V24 can be powered
by the external VA supply, and a 24V supply is not needed.
When V24 is powered by the VA supply, the device always indicates a 24V undervoltage fault due to the V24UV bit in the
FAULT1 register, and the FAULT pin is always active (low) if the bit is unmasked in the F1MASK register. To overcome
this, set bit V24UV_M in the F1MASK register to 1.
Isolating the SPI
A companion digital isolator, the MAX14483, is optimized to support the MAX22196. The MAX14483 is a six-channel,
3.75kVRMS, low-power digital isolator ideal for interfacing to low-voltage products such as microcontrollers or FPGAs.
Figure 18 demonstrates two MAX22196 devices in daisy-chain operation, showing SPI signals, control signals, and power
monitoring signal isolated between the field and logic side of the design. A single MAX14483 can be used for multiple
MAX22196 devices. Figure 19 demonstrates two MAX22196 devices operated in addressable SPI mode, meaning they
share a common chip select (CS) signal from the SPI controller (MCU or FPGA).
The addressable SPI mode can accommodate up to four devices sharing a common CS signal. When more than four
devices are required in a module, daisy-chain configuration can be used. In daisy-chain mode, the number of SPI clock
cycles per read or write command is N x 16 with CRC disabled, or N x 24 with CRC enabled, where N is the number of
devices in the daisy chain, creating a longer SPI read/write delay.



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