MAX22196

Octal Industrial Sink/Source

Digital Input

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Analog Devices | 2

Absolute Maximum Ratings

V24 to GND ......................................................... -0.3V to +70V

IN_ to GND........................................................... -40V to +40V

(V24 – IN_) to GND .............................................. -40V to +70V

VMOK to GND..........................................-0.3V to (V24 + 0.3)V

VA, VL to GND....................................................... -0.3V to +6V

VM to GND

__VA ≥ VA_UVLO....................................... -0.3V to (VA + 0.3)V

__VA < VA_UVLO.......................-0.3V to (Min(3.3, V24) + 0.3)V

REGEN to GND

__VA ≥ VA_UVLO....................................... -0.3V to (VA + 0.3)V

__VA < VA_UVLO.......................-0.3V to (Min(3.3, V24) + 0.3)V

Digital Pins

__CS, SCLK, SDI, LATCH to GND....................... -0.3V to +6V

__A1, A0 to GND ...................................... -0.3V to (VA + 0.3)V

__DAISY, CRCEN to GND ................................... -0.3V to +6V

__FAULT to GND ..................................................-0.3V to +6V

__READY, SDO to GND ........................... -0.3V to (VL + 0.3)V

Analog Pins

__REFDI to GND .......................................-0.3V to (VA + 0.3)V

__LO1–LO6 to GND ..................................-0.3V to (VA + 0.3)V

Continuous Power Dissipation (TA = +70°C)

__Single-Layer Board (derate 21.3°C/mW above +70°C)

................................................................................. 1702.1mW

__Four-Layer Board (derate 34.5°C/mW above +70°C)

................................................................................. 2758.6mW

Temperature Ratings

__Operating Temperature Range................... -40°C to +125°C

__Maximum Junction Temperature ...............................+150°C

__Storage Temperature Range...................... -60°C to +150°C

__Lead Temperature (soldering, 10s) ...........................+300°C

__Soldering Temperature (reflow).................................+260°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or

any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Information

PACKAGE TYPE

32 TQFN

Package Code

T3255+8C

Outline Number

21-0140

Land Pattern Number

90-0013

THERMAL RESISTANCE, SINGLE-LAYER BOARD

Junction-to-Ambient (θJA)

47°C/W

Junction-to-Case Thermal Resistance (θJC)

1.7°C/W

THERMAL RESISTANCE, FOUR-LAYER BOARD

Junction-to-Ambient (θJA)

29°C/W

Junction-to-Case Thermal Resistance (θJC)

1.7°C/W

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.

For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”,

“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing

pertains to the package regardless of RoHS status.