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RAA210825 Datasheet(PDF) 49 Page - Renesas Technology Corp |
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RAA210825 Datasheet(HTML) 49 Page - Renesas Technology Corp |
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49 / 56 page ![]() FN9349 Rev.1.00 Page 49 of 56 Feb 8, 2019 RAA210825 9. Package Outline Drawing 9. Package Outline Drawing Y41.17x19 41 I/O 17.0mm x 19.0mmx3.6mm HDA Module Rev 1, 5/16 2X 0.10 C 3.6 ±0.1 0.025 MAX // 0.10 C C SIDE VIEW 0.08 C SEATING DETAIL A TERMINAL #A1 INDEX AREA B TOP VIEW 0.20 REF 21 x 0.60 ±0.05 3 3 0.05 C TERMINAL TIP BOTTOM VIEW PIN 1 INDICATOR DATUM B DATUM A 0.30 REF SEE 0.30 REF 21 x 0.60 ±0.05 0.20 REF 1.00 BSC 1.00 BSC 2 2 DETAIL A PLANE 2X 0.10 C 17.00 BSC 19.00 BSC A 18.50 ±0.15 16.50 ±0.15 M 0.10 C A B M 0.10 C A B 12.00 M 0.10 C A B M NOTES: 1. All dimensions are in millimeters. 2. Represents the basic land grid pitch. 3. The total number of I/O (excluding dummy pads). 4. Unless otherwise specified, tolerance: decimal ±0.10. 5. Dimensioning and tolerancing per ASME Y14.M-2009. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 2.975 1.350 0.20 REF 0.475 1.300 A B C D E F G H J K L M N P R T U V W 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 9.00 For the most recent package outline drawing, see Y41.17x19. |
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