Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Pin Configuration and Functions...................................3

6 Specifications.................................................................. 4

6.1 Absolute Maximum Ratings........................................ 4

6.2 ESD Ratings............................................................... 4

6.3 Recommended Operating Conditions.........................5

Thermal Information..........................................................5

6.4 Electrical Characteristics.............................................6

6.5 Typical Characteristics................................................ 7

7 Detailed Description......................................................12

7.1 Overview................................................................... 12

7.2 Functional Block Diagram......................................... 12

7.3 Feature Description...................................................12

7.4 Device Functional Modes..........................................14

8 Application and Implementation.................................. 15

8.1 Application Information............................................. 15

8.2 Typical Application.................................................... 15

8.3 Best Design Practices...............................................19

8.4 Power Supply Recommendations.............................20

8.5 Layout....................................................................... 20

9 Device and Documentation Support............................21

9.1 Device Support......................................................... 21

9.2 Documentation Support............................................ 21

9.3 Receiving Notification of Documentation Updates....21

9.4 Support Resources................................................... 21

9.5 Trademarks...............................................................21

9.6 Electrostatic Discharge Caution................................21

9.7 Glossary....................................................................21

10 Mechanical, Packaging, and Orderable

Information.................................................................... 22

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision E (December 2022) to Revision F (March 2023)

Page

• Changed fixed output options to show the range of options instead of each individually in Features section... 1

•

Corrected the abs max rating of VOUT pin for legacy chip ................................................................................ 4

•

Corrected the operating max range of VOUT pin................................................................................................ 5

•

Corrected the supported output current range from 50 mA to 150 mA..............................................................5

• Changed Application Curves section................................................................................................................18

Changes from Revision D (January 2015) to Revision E (December 2022)

Page

• Changed document title, Features, Applications, and Description sections and added M3 device information

to document........................................................................................................................................................ 1

• Changed Pin Configuration and Functions section.............................................................................................3

• Added new chip specific curves to Typical Characteristics section.................................................................... 7

• Changed Overview section...............................................................................................................................12

• Changed Functional Block Diagram image...................................................................................................... 12

• Changed Feature Description section.............................................................................................................. 12

• Deleted thermal shutdown discussion from Current Limit section.................................................................... 13

• Changed Normal Operation section................................................................................................................. 14

• Changed Dropout Operation section................................................................................................................ 14

• Changed Application Information section......................................................................................................... 15

• Added External Capacitor Requirements, Reverse Current, and Power Dissipation sub-sections to Detailed

Design Procedure section.................................................................................................................................15

• Changed Input and Output Capacitor Requirements section........................................................................... 15

• Added Reverse Current section........................................................................................................................16

• Changed Estimating Junction Temperature section......................................................................................... 17

• Added Best Design Practices section...............................................................................................................19

• Changed Power Supply Recommendations section.........................................................................................20

• Changed Layout Guidelines section................................................................................................................. 20

• Changed Power Dissipation section: changed title and deleted last sentence from section............................ 20

• Added M3 row to Available Options table.........................................................................................................21

TLV704

SBVS148F – SEPTEMBER 2010 – REVISED MARCH 2023

www.ti.com

2

Submit Document Feedback

Copyright © 2023 Texas Instruments Incorporated

Product Folder Links: TLV704