AD8397

Rev. 0 | Page 7 of 16

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Rating

Supply Voltage

26.4 V

Power Dissipation1

See Figure 4

Storage Temperature

−65°C to +125°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature Range

(Soldering 10 sec)

300°C

Junction Temperature

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational sec-

tion of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

MAXIMUM POWER DISSIPATION

The maximum power that can be dissipated safely by

the AD8397 is limited by the associated rise in junction

temperature. The maximum safe junction temperature for

plastic encapsulated devices is determined by the glass

transition temperature of the plastic, approximately 150°C.

Temporarily exceeding this limit may cause a shift in

parametric performance due to a change in the stresses

exerted on the die by the package.

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0

–40 –30 –20 –10

0

1020

304050

60708090

AMBIENT TEMPERATURE (

°C)

8-LEAD SOIC

8-LEAD SOIC EPAD

Figure 4. Maximum Power Dissipation vs. Temperature

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate

on the human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy elec-

trostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation

or loss of functionality.