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MPC106EC Datasheet(PDF) 6 Page - NXP Semiconductors |
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MPC106EC Datasheet(HTML) 6 Page - NXP Semiconductors |
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6 / 28 page ![]() 6 MPC106 PCI Bridge/Memory Controller Hardware Specifications Electrical and Thermal Characteristics Table 3 provides the package thermal characteristics for the 106. Table 4 provides the DC electrical characteristics for the 106, assuming Vdd = AVdd = 3.3 ± 5% V DC, GND = 0 V DC, and 0 ≤ T j ≤ 105 °C. Table 5 lists the power consumption of the 106. Table 2. Recommended Operating Conditions Characteristic Symbol Value Unit Notes Supply voltage Vdd 3.3 ± 165 mv V — PLL supply voltage AVdd 3.3 ± 165 mv V — Input voltage Vin 0 to 5.5 V — Die junction temperature Tj 0 to 105 °C The extended temperature parts have die junction temperature of -40 to 105°C Table 3. Package Thermal Characteristics Characteristic Symbol Value Rating CBGA package thermal resistance, junction-to-top of die θ JC 0.133 °C/W Note: Refer to Section 1.8, “System Design Information,” for more details about thermal management. Table 4. DC Electrical Specifications Characteristic Symbol Min Max Unit Input high voltage (all inputs except SYSCLK) V IH 2 5.5 V Input low voltage (all inputs except SYSCLK) V IL GND 0.8 V SYSCLK input high voltage CV IH 2.4 5.5 V SYSCLK input low voltage CV IL GND 0.4 V Input leakage current, V in =3.3 V1 I in — 15.0 µA Hi-Z (off-state) leakage current, V in = 3.3 V1 I TSI — 15.0 µA Output high voltage, I OH = -7 mA2 V OH 2.4 — V Output low voltage, I OL = 7 mA2 V OL — 0.5 V PCI 3.3 V signaling output high voltage, I OH = -0.5 mA2 V OH 2.7 — V PCI 3.3 V signaling output low voltage, I OL = 1.5 mA2 V OL — 0.3 V Capacitance, V in = 0 V, f = 1 MHz3 C in — 7.0 pF Notes: 1 Excludes test signals (LSSD_MODE and JTAG signals). 2 This value represents worst case 40-ohm drivers (default value for Processor/L2 control signals CI, WT, GBL, TBST, TSIZ[0–2], TT[0–4], TWE, and TV) only. Other signals have lower default driver impedance and will support larger IOH and IOL. All drivers may optionally be programmed to different driver strengths. 3 Capacitance is periodically sampled rather than 100% tested. Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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