NXP Semiconductors

NVT2001; NVT2002

Bidirectional voltage level translator for open-drain and push-pull applications

3 Ordering information

Tamb = -40 °C to +105 °C.

Package

Type number

Topside

marking

Number

of bits

Name

Description

Version

NVT2002DP[1] N2002

2

TSSOP8

plastic thin shrink small outline package; 8 leads;

body width 3 mm

SOT505-1

NVT2002GD

N02

2

XSON8U

plastic extremely thin small outline package; no

leads; 8 terminals; UTLP based; body 3 × 2 × 0.5

mm

SOT996-2

NVT2002TL

tT2

2

HXSON8

thermal enhanced extremely thin small outline

package; no leads; 8 terminals, 0.5 mm pitch, 3 mm

x 2 mm x 0.5 mm body

SOT1052-2

NVT2001GM

T1

1

XSON6

plastic extremely thin small outline package; no

leads; 6 terminals; body 1 × 1.45 × 0.5 mm; requires

SSB

SOT886

Table 1. Ordering information

[1]

GTL2002DP = NVT2002DP.

3.1 Ordering options

Type number

Orderable part

number

Package

Packing method [1]

Minimum

order

quantity

Temperature

NVT2002DP

NVT2002DP,118

TSSOP8

Reel 13" Q1/T1 *Standard

mark SMD

2500

Tamb = -40 °C to +105 °C

NVT2002GD

NVT2002GD,125 [2] XSON8U

Reel 7" Q3/T4 *Standard

mark

3000

Tamb = -40 °C to +105 °C

NVT2002TL

NVT2002TLH

HXSON8

Reel 7" Q3/T4 NDP

4000

Tamb = -40 °C to +105 °C

NVT2001GM

NVT2001GMZ

XSON6

Reel 7" Q1/T1 *Standard

mark SMD SSB [3]

5000

Tamb = -40 °C to +105 °C

Table 2. Ordering options

[1]

Standard packing quantities and other packaging data are available at www.nxp.com/packages/.

[2]

Discontinuation Notice 202111012DN; drop in replacement is NVT2002TLH.

The TL package has a center pad vs no center pad for the GD package. The TL package pad is not electrically connected to the silicon and is not required

to connect to the PCB so it can drop onto the GD package PCB layout. If the existing GD package has a trace underneath the risk is low since the TL

package center pad is not connected to the silicon. If there are multiple traces there could be EMI and cross talk. In both cases the customer needs to

evaluate risk.

Note: The length and width are reversed between the "GD" and "TL" package drawings but the shorter edge contains the pins and is 2.0 mm in both

cases.

[3]

This packing method uses a Static Shielding Bag (SSB) solution. Material is to be kept in the sealed bag between uses.

NVT2001_NVT2002

All information provided in this document is subject to legal disclaimers.

© 2023 NXP B.V. All rights reserved.

Product data sheet

Rev. 4.4 — 22 May 2023

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