NVT2002TLH datasheet(32/32 Pages) NXP

32 / 32 page

NXP Semiconductors

NVT2001; NVT2002

Bidirectional voltage level translator for open-drain and push-pull applications

Contents

General description ............................................ 1

Features and benefits .........................................1

Ordering information .......................................... 2

3.1

Ordering options ................................................ 2

Functional diagram .............................................3

Pinning information ............................................ 3

5.1

Pinning ...............................................................3

5.1.1

1-bit in XSON6 package ....................................3

5.1.2

2-bit in TSSOP8 and XSON8U packages ..........3

5.2

Pin description ................................................... 4

Functional description ........................................4

6.1

Function table .................................................... 4

Application design-in information .....................5

7.1

Enable and disable ............................................5

7.2

Bidirectional translation ......................................7

7.3

How to size pull-up resistor value ......................7

7.4

How to design for maximum frequency

operation ............................................................9

7.5

GD package vs TL package ............................10

Limiting values ..................................................10

Recommended operating conditions .............. 10

Static characteristics ........................................11

Dynamic characteristics ...................................12

11.1

Open-drain drivers ...........................................12

Performance curves ..........................................13

Package outline .................................................15

Soldering of SMD packages .............................20

14.1

Introduction to soldering .............................

14.2

Wave and reflow soldering .........................

14.3

Wave soldering ...........................................

14.4

Reflow soldering .........................................

Soldering: PCB footprints ................................22

Abbreviations .................................................... 28

Revision history ................................................ 28

Legal information ..............................................29

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section 'Legal information'.

For more information, please visit: http://www.nxp.com

Date of release: 22 May 2023

Document identifier: NVT2001_NVT2002

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