1996 May 21

9

Philips Semiconductors

Product specification

UHF amplifier module

BGY205

SOLDERING

The indicated temperatures are those at the solder

interfaces.

Advised solder types are types with a liquidus less than or

equal to 210

°C.

Solder dots or solder prints must be large enough to wet

the contact areas.

Footprints for soldering should cover the module contact

area +0.1 mm on all sides.

Soldering can be carried out using a conveyor oven, a hot

air oven, an infrared oven or a combination of these ovens.

Hand soldering must be avoided because the soldering

iron tip can exceed the maximum permitted temperature of

250

°C and damage the module.

The maximum temperature profile and soldering time is

indicated as follows (see Fig.18):

t = 350 s at 100

°C

t = 300 s at 125

°C

t = 200 s at 150

°C

t = 100 s at 175

°C

t = 50 s at 200

°C

t = 5 s at 250

°C (maximum temperature).

Cleaning

The following fluids may be used for cleaning:

• Alcohol

• Bio-Act (Terpene Hydrocarbon)

• Triclean B/S

• Acetone.

Ultrasonic cleaning should not be used since this can

cause serious damage to the product.

Fig.18 Maximum allowable temperature profile.

handbook, halfpage

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300

200

100

0

100

200

400

MLB740

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