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BLV862 Datasheet(PDF) 3 Page - NXP Semiconductors |
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BLV862 Datasheet(HTML) 3 Page - NXP Semiconductors |
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3 / 12 page ![]() 1999 Jun 25 3 Philips Semiconductors Product specification UHF linear push-pull power transistor BLV862 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). THERMAL CHARACTERISTICS Note 1. Thermal resistance is determined under specified RF operating conditions. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCBO collector-base voltage open emitter − 65 V VCEO collector-emitter voltage open base − 30 V VEBO emitter-base voltage open collector − 3V IC collector current (DC) − 25 A Ptot total power dissipation Tmb =25 °C − 350 W Tstg storage temperature −65 +150 °C Tj operating junction temperature − 200 °C SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-mb thermal resistance from junction to mounting base Ptot = 350 W; note 1 0.5 K/W Rth mb-h thermal resistance from mounting base to heatsink note 1 0.15 K/W Fig.2 DC SOAR. Total device; both sections equally loaded. (1) Tmb =25 °C. (2) Th =70 °C. handbook, halfpage 102 10 1 MBK231 110 102 VCE (V) IC (A) (1) (2) Total device; both sections equally loaded. (1) Continuous operation. (2) Short time operation during mismatch. Fig.3 Power derating curves. handbook, halfpage 0 40 80 160 400 Ptot (W) 300 100 0 200 MGD528 120 Th (°C) (2) (1) |
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