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NTS0102DP125 Datasheet(PDF) 16 Page - NXP Semiconductors |
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NTS0102DP125 Datasheet(HTML) 16 Page - NXP Semiconductors |
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16 / 43 page ![]() NXP Semiconductors NTS0102 Dual supply translating transceiver; open-drain; auto direction sensing dependent upon the output impedance and edge-rate of the external driver. The limits provided for these parameters in the data sheet assume a driver with output impedance below 50 Ω is used. 13.4 Output load considerations The maximum lumped capacitive load that can be driven is dependent upon the one-shot pulse duration. In cases with very heavy capacitive loading, there is a risk that the output will not reach the positive rail within the one-shot pulse duration. To avoid excessive capacitive loading, and to ensure correct triggering of the one-shot, it's recommended to use short trace lengths and low capacitance connectors on NTS0102 PCB layouts. To ensure low impedance termination and avoid output signal oscillations and one-shot re-triggering, the length of the PCB trace should be such that the round trip delay of any reflection is within the one-shot pulse duration (approximately 50 ns). 13.5 Power up During operation VCC(A) must never be higher than VCC(B), however during power-up VCC(A) ≥ VCC(B) does not damage the device, so either power supply can be ramped up first. There is no special power-up sequencing required. The NTS0102 includes circuitry that disables all output ports when either VCC(A) or VCC(B) is switched off. 13.6 Enable and disable An output enable input (OE) is used to disable the device. Setting OE = LOW causes all I/Os to assume the high-impedance OFF-state. The disable time (tdis with no external load) indicates the delay between when OE goes LOW and when outputs actually become disabled. The enable time (ten) indicates the amount of time the user must allow for one one-shot circuitry to become operational after OE is taken HIGH. To ensure the high-impedance OFF-state during power-up or power-down, pin OE should be tied to GND through a pull-down resistor, the minimum value of the resistor is determined by the current-sourcing capability of the driver. 13.7 Pull-up or pull-down resistors on I/Os lines Each A port I/O has an internal 10 kΩ pull-up resistor to VCC(A), and each B port I/O has an internal 10 kΩ pull- up resistor to VCC(B). If a smaller value of pull-up resistor is required, an external resistor must be added parallel to the internal 10 kΩ, this effects the VOL level. When OE goes LOW the internal pull-ups of the NTS0102 are disabled. 13.8 GD package vs TL package Due to differences in package construction the TL package has a center pad vs no center pad for the GD package. The following section provides guidance in replacement vs new applications. • No trace under GD package 1. Replacement of GD package: The pad is not electrically connected to the silicon (no wire bond and epoxy is not conductive) and can be left floating. It is not required to be connected to the PCB. Simply place the TL package on the same PCB traces as the existing GD package. NTS0102 All information provided in this document is subject to legal disclaimers. © 2023 NXP B.V. All rights reserved. Product data sheet Rev. 4.5 — 6 July 2023 16 / 43 |
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