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NTS0102DP125 Datasheet(PDF) 16 Page - NXP Semiconductors

Part # NTS0102DP125
Description  Dual supply translating transceiver; open-drain; auto direction sensing
PDF  43 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

NTS0102DP125 Datasheet(HTML) 16 Page - NXP Semiconductors

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NXP Semiconductors
NTS0102
Dual supply translating transceiver; open-drain; auto direction sensing
dependent upon the output impedance and edge-rate of the external driver. The limits provided for these
parameters in the data sheet assume a driver with output impedance below 50 Ω is used.
13.4 Output load considerations
The maximum lumped capacitive load that can be driven is dependent upon the one-shot pulse duration. In
cases with very heavy capacitive loading, there is a risk that the output will not reach the positive rail within the
one-shot pulse duration.
To avoid excessive capacitive loading, and to ensure correct triggering of the one-shot, it's recommended to
use short trace lengths and low capacitance connectors on NTS0102 PCB layouts. To ensure low impedance
termination and avoid output signal oscillations and one-shot re-triggering, the length of the PCB trace should
be such that the round trip delay of any reflection is within the one-shot pulse duration (approximately 50 ns).
13.5 Power up
During operation VCC(A) must never be higher than VCC(B), however during power-up VCC(A) ≥ VCC(B) does not
damage the device, so either power supply can be ramped up first. There is no special power-up sequencing
required. The NTS0102 includes circuitry that disables all output ports when either VCC(A) or VCC(B) is switched
off.
13.6 Enable and disable
An output enable input (OE) is used to disable the device. Setting OE = LOW
causes all I/Os to assume the high-impedance OFF-state. The disable time (tdis with no external load) indicates
the delay between when OE goes LOW and when outputs actually become disabled. The enable time (ten)
indicates the amount of time the user must allow for one one-shot circuitry to become operational after OE is
taken HIGH. To ensure the high-impedance OFF-state during power-up or power-down, pin OE should be tied
to GND through a pull-down resistor, the minimum value of the resistor is determined by the current-sourcing
capability of the driver.
13.7 Pull-up or pull-down resistors on I/Os lines
Each A port I/O has an internal 10 kΩ pull-up resistor to VCC(A), and each B port I/O has an internal 10 kΩ pull-
up resistor to VCC(B). If a smaller value of pull-up resistor is required, an external resistor must be added parallel
to the internal 10 kΩ, this effects the VOL level. When OE goes LOW the internal pull-ups of the NTS0102 are
disabled.
13.8 GD package vs TL package
Due to differences in package construction the TL package has a center pad vs no center pad for the GD
package. The following section provides guidance in replacement vs new applications.
• No trace under GD package
1. Replacement of GD package: The pad is not electrically connected to the silicon (no wire bond and epoxy
is not conductive) and can be left floating. It is not required to be connected to the PCB. Simply place the
TL package on the same PCB traces as the existing GD package.
NTS0102
All information provided in this document is subject to legal disclaimers.
© 2023 NXP B.V. All rights reserved.
Product data sheet
Rev. 4.5 — 6 July 2023
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