NTS0102DP125 datasheet(43/43 Pages) NXP

43 / 43 page

NXP Semiconductors

NTS0102

Dual supply translating transceiver; open-drain; auto direction sensing

Contents

General description ............................................ 1

Features and benefits .........................................1

Applications .........................................................1

Ordering information .......................................... 1

4.1

Ordering options ................................................ 2

Functional diagram .............................................3

Pinning information ............................................ 3

6.1

Pinning ...............................................................3

6.2

Pin description ................................................... 4

Functional description ........................................4

Limiting values ....................................................5

Recommended operating conditions ................ 5

Static characteristics ..........................................6

Dynamic characteristics .....................................8

Waveforms ......................................................... 12

Application information ....................................14

13.1

Applications ......................................................14

13.2

Architecture ......................................................15

13.3

Input driver requirements .................................15

13.4

Output load considerations ..............................16

13.5

Power up ......................................................... 16

13.6

Enable and disable ..........................................16

13.7

Pull-up or pull-down resistors on I/Os lines ......16

13.8

GD package vs TL package ............................16

Package outline .................................................18

Soldering of SMD packages .............................25

15.1

Introduction to soldering .................................. 25

15.2

Wave and reflow soldering .............................. 25

15.3

Wave soldering ................................................25

15.4

Reflow soldering .............................................. 25

Soldering: PCB footprints ................................27

Abbreviations .................................................... 39

Revision history ................................................ 39

Legal information ..............................................40

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section 'Legal information'.

For more information, please visit: http://www.nxp.com

Date of release: 6 July 2023

Document identifier: NTS0102

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