NTS0102DP125 datasheet(42/43 Pages) NXP

42 / 43 page

NXP Semiconductors

NTS0102

Dual supply translating transceiver; open-drain; auto direction sensing

Tables

Tab. 1.

Ordering information ..........................................1

Tab. 2.

Ordering options ................................................2

Tab. 3.

Pin description ...................................................4

Tab. 4.

Function table ....................................................4

Tab. 5.

Limiting values .................................................. 5

Tab. 6.

Recommended operating conditions .................5

Tab. 7.

Typical static characteristics ..............................6

Tab. 8.

Typical supply current ....................................... 6

Tab. 9.

Static characteristics ......................................... 6

Tab. 10. Dynamic characteristics for temperature

range -40 °C to +85 °C .....................................8

Tab. 11. Dynamic characteristics for temperature

range -40 °C to +125 °C .................................10

Tab. 12. Measurement points ........................................13

Tab. 13. Test data ..........................................................14

Tab. 14. SnPb eutectic process (from J-STD-020D) ..... 26

Tab. 15. Lead-free process (from J-STD-020D) ............26

Tab. 16. Abbreviations ...................................................39

Tab. 17. Revision history ...............................................39

Figures

Fig. 1.

Logic symbol ..................................................... 3

Fig. 2.

Pin configuration SOT505-2 (TSSOP8) .............3

Fig. 3.

Pin configuration SOT833-1 (XSON8) and

SOT1089 (XSON8) ........................................... 3

Fig. 4.

Pin configuration SOT996-2 (XSON8) ...............4

Fig. 5.

Pin configuration SOT1052-2 (XSON8) .............4

Fig. 6.

Pin configuration SOT2015-1 (X2SON8) ...........4

Fig. 7.

The data input (An, Bn) to data output (Bn,

An) propagation delay times ........................... 12

Fig. 8.

Enable and disable times ................................13

Fig. 9.

Test circuit for measuring switching times ....... 14

Fig. 10.

Typical operating circuit ...................................15

Fig. 11.

Architecture of NTS0102 I/O cell (one

channel) ...........................................................15

Fig. 12.

Package outline SOT505-2 (TSSOP8) ............18

Fig. 13.

Package outline SOT833-1 (XSON8) ..............19

Fig. 14.

Package outline SOT996-2 (XSON8) ..............20

Fig. 15.

Package outline SOT1089 (XSON8) ...............21

Fig. 16.

Package outline SOT1052-2 (XSON8) ............22

Fig. 17.

Package outline SOT1052-2 (XSON8) ............23

Fig. 18.

Package outline SOT2015-1 (X2SON8) ..........24

Fig. 19.

Temperature profiles for large and small

components .....................................................26

Fig. 20.

PCB footprint for SOT505-2 (TSSOP8);

reflow soldering ............................................... 27

Fig. 21.

PCB footprint for SOT833-1 (XSON8);

reflow soldering ............................................... 28

Fig. 22.

PCB footprint for SOT996-2 (XSON8U);

reflow soldering ............................................... 29

Fig. 23.

PCB footprint for SOT1089 (XSON8);

reflow soldering ............................................... 30

Fig. 24.

PCB footprint for SOT1052-2 (XSON8);

recommended solder mask opening pattern ... 31

Fig. 25.

PCB footprint for SOT1052-2 (XSON8);

recommended I/O pads and solderable

area ................................................................. 32

Fig. 26.

PCB footprint for SOT1052-2 (XSON8);

recommended solder paste stencil ..................33

Fig. 27.

PCB footprint for SOT1052-2 (XSON8);

notes ................................................................34

Fig. 28.

PCB footprint for SOT2015-1 (X2SON8);

recommended solder mask opening pattern ... 35

Fig. 29.

PCB footprint for SOT2015-1 (X2SON8);

recommended I/O pads and solderable

area ................................................................. 36

Fig. 30.

PCB footprint for SOT2015-1 (X2SON8);

recommended solder paste stencil ..................37

Fig. 31.

PCB footprint for SOT2015-1 (X2SON8);

notes ................................................................38

NTS0102

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 4.5 — 6 July 2023

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