Data Sheet G13783EJ3V0DS

6

μ PC337

RECOMMENDED SOLDERING CONDITIONS

The

μPC337 should be soldered and mounted under the following recommended conditions.

For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales

representative.

For technical information, see the following website.

Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)

Through-hole devices

μPC337HF: 3PIN PLASTIC SIP (MP-45G) (Isolated TO-220)

Process

Conditions

Recommend

Wave soldering

(only to leads)

Solder temperature: 260

°C or below,

Flow time: 10 seconds or less.

WS60-00-1

Partial heating method

Pin temperature: 350

°C or below,

Heat time: 3 seconds or less (Per each pin).

P350

μPC337HF-AZ: 3PIN PLASTIC SIP (MP-45G) (Isolated TO-220)

Note

Process

Conditions

Recommend

Wave soldering

(only to leads)

Solder temperature: 260

°C or below,

Flow time: 10 seconds or less.

WS60-00-1

Partial heating method

Pin temperature: 350

°C or below,

Heat time: 3 seconds or less (Per each pin).

P350

Note Pb-free (This product does not contain Pb in external electrode.)

Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure

that the package body does not get jet soldered.

REFERENCE DOCUMENTS

Document Name

Document No.

Usage of Three-Terminal Regulators User’s Manual

G12702E

Semiconductor Device Mount Manual

http://www.necel.com/pkg/en/mount/index.html

Review of Quality and Reliability Handbook Information

C12769E

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