VITESSE

SEMICONDUCTOR CORPORATION

Datasheet

VSC835

2.5 Gbits/sec

34x34 Crosspoint Switch with Signal Detection

Page 10

© VITESSE SEMICONDUCTOR CORPORATION

741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896

7/24/00

G52270-0, Rev. 4.1

Package Pin Descriptions

The VSC835 is packaged in a 27x27mm 256 pin ball grid array package. The 256 BGA package is ther-

mally enhanced and carries the high-speed signals over controlled impedance lines from the solder ball to the

circuit die. The following sections describe the pinout and mechanical details of the VSC835.

Figure 6: Functional Pinout Floorplan

34:1 Switch slice

A0

A1

A2

A3

A4

A33

A32

A5

Y0

Y1

Y2

Y3

Y33

34:1 Switch slice

34:1 Switch slice

34:1 Switch slice

Programming

interface

I/P LOS and termination

I/P LOS and termination

control logic

Y32

34:1 Switch slice

34:1 Switch slice

Y31

34:1 Switch slice