7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) (3)

MIN

MAX

UNIT

VDD – VSS

Supply voltage

28

V

VDD

–0.5

28

V

VSS

–28

0.5

V

VSEL or VEN

Logic control input pin voltage (EN, Ax, SELx)

–0.5

28

V

ISEL or IEN

Logic control input pin current (EN, Ax, SELx)

–0.5

28

mA

VS or VD

Source or drain voltage (Sx, D)

VSS–0.5

VDD+0.5

V

IIK

Diode clamp current(2)

–30

30

mA

IS or ID (CONT)

Source or drain continuous current (Sx, D)

–10

10

mA

TJ

Junction temperature

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not

sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality,

performance, and shorten the device lifetime.

(2)

Pins are diode-clamped to the power-supply rails. Over voltage signals must be voltage and current limited to maximum ratings.

(3)

To avoid drawing excess current from VDD, or into VSS, the voltage drop across the bidirectional switch path (ΔVswitch) must not exceed

1.2 V (600 mV for high temperature).

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001,

all pins(1)

±2000

V

Charged device model (CDM), per ANSI/ESDA/JEDEC

JS-002, all pins(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

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TMUX4051, TMUX4052, TMUX4053

SCDS445B – MAY 2022 – REVISED MARCH 2023

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