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ELECTRICAL

Item

Requirement

Test Condition

Low Level Contact

Resistance

(Contact & Switch)

Contact resistance:

50mΩ max. △CR < 30m Ω

after test. Switch resistance:

200mΩ max

Comply with EIA-364-23.

Apply a closed-circuit current of 100 mA

maximum at an open-circuit voltage of

20mV maximum on contact point and solder

pad of PCB.

Insulation Resistance

(Initial) 1000 MΩ minimum.

(Final) 500 MΩ minimum

Comply with EIA-364-21.

Apply 200 VDC ±10VDC on the adjacent

contacts for 1 minute ±5 seconds

Dielectric Withstanding

Voltage

No shorting, breakdown,

flashover or other damage.

Comply with EIA-364-20.Apply

500 VAC for one minute at sea level on

unmated connectors, less than 1 mA

leakage current.

MECHANICAL

Item

Requirement

Test Condition

Tray Insertion Force

20N Max. (25mm/minute)

MIL-STD-1344, Method 2013.1

Applicable Nano SIM Card

Tray Extraction Force

4N min. after 200 cycles (with

hands)

3N min. after 4400 cycles

(with hands)

No evidence of damage

The electrical performances

should meet the spec.

specified.(25mm/minute).

MIL-STD-1344, Method 2013.1

Applicable Nano SIM Card

Contact Normal Force

40gf Min./per Pin

0.10mm Gap to housing surface

(work position) Speed of 25±3mm/minute

Durability

(Mating/ Un-mating)

4N min after 200cycles

(with hands)

3N min after 4400cycles

(with hands)

No evidence of damage

The electrical performances

should meet the spec.

specified

1. Push tray with card in connector and let

the tray out with pushing Lever (with

hands) for 4400 cycles

2. Mating and un-mating connector

（

with machine） for 200 cycles.

3. Applicable Nano SIM Card (5 pcs by

maximum thickness size card (0.7mm) ) (5

pcs by minimum thickness size

card(0.6mm)) for test.

4. Check point: after 200 cycles