MPQ5072

– 5.5V, 1A LOW RDS(ON) LOAD SWITCH, AEC-Q100 QUALIFIED

MPQ5072 Rev. 1.0

www.MonolithicPower.com

3

10/16/2020

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PIN FUNCTIONS

Pin #

Name Description

1

EN

Enable input. Pull EN below the specified threshold to shut down the chip.

2

GND

Ground.

3

VCC

Supply voltage to the control circuitry.

4

ILIM

Output current limit configuration. Place a resistor to GND to set the overload current

limit level.

5

SS

Soft start. An external capacitor connected to the SS pin sets the slew rate of the output

voltage soft-start period.

6, 11,

exposed pad

VIN

Input power supply.

9

VOUT Output to the load.

12

PG

Power good. Push/pull output.

7, 8, 10

NC

Not connected. It is recommended to connect this pin to VOUT to improve thermal

performance.

ABSOLUTE MAXIMUM RATINGS (1)

VIN ................................................-0.3V to +6.5V

VCC ...............................................-0.3V to +6.5V

VOUT..............................................-0.3V to +6.5V

EN, SS, ILIM ......................... -0.3V to VCC +0.3V

Junction temperature ................................150°C

Lead temperature .....................................260°C

Continuous power dissipation (2)

QFN-12 (2mmx2mm) ................................. 1.6W

ESD Ratings

Human body model (HBM) ........................±2kV

Charged device model (CDM) ................ ±750V

Recommended Operating Conditions (3)

Supply voltage (VIN) ........................0.5V to 5.5V

Supply voltage (VCC) ..........................3V to 5.5V

Output voltage (VOUT) ......................0.5V to 5.5V

Operating junction temp (TJ) .... -40°C to +125°C

Thermal Resistance (4)

θJA

θJC

QFN-12 (2mmx2mm) ..

……....80........16...°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θ

JA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX) - TA) / θJA. Exceeding the maximum allowable power

dissipation can cause excessive die temperature, and the

device may go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its operating

conditions.

4) Measured on JESD51-7, 4-layer PCB.