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BU505DF Datasheet(PDF) 3 Page - NXP Semiconductors |
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BU505DF Datasheet(HTML) 3 Page - NXP Semiconductors |
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3 / 12 page ![]() 1997 Aug 13 3 Philips Semiconductors Product specification Silicon diffused power transistors BU505F; BU505DF ISOLATION CHARACTERISTICS LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER TYP. MAX. UNIT VisolM isolation voltage from all terminals to external heatsink (peak value) − 1500 V Cisol isolation capacitance from collector to external heatsink 12 − pF SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCESM collector-emitter peak voltage VBE =0 − 1500 V VCEO collector-emitter voltage open base − 700 V ICsat collector saturation current − 2A IC collector current (DC) see Figs 4 and 5 − 2.5 A ICM collector current (peak value) see Figs 4 and 5 − 4A IB base current (DC) − 2A IBM base current (peak value) − 4A Ptot total power dissipation Th ≤ 25 °C; see Fig.2 − 20 W Tstg storage temperature −65 +150 °C Tj junction temperature − 150 °C Fig.2 Power derating curve. handbook, halfpage 050 Th ( oC) 100 150 120 0 40 80 MGK674 Ptot max (%) Fig.3 DC current gain; typical values. Tj =25 °C. (1) VCE =5V. (2) VCE =1V. handbook, halfpage 10−2 10−1 1 102 10 1 hFE IC (A) 10 MGB875 (1) (2) |
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