DA9279.003

13 July 2006

4 (10)

IC OUTLINES

Figure 1. MAS9279A1, A3, A5, A7

Figure 2. MAS9279A2, A4, A6, A8

Note 1: MAS9279 pads are round with 80 µm diameter at opening.

Note 2: Pin CLK can either be connected to VSS or left floating, pin PV should be connected to Ground or left

floating and pin TE1 must be left floating in VCTCXO module end-user application.

Note 3: Die map reference is the actual left bottom corner of the sawn chip.

SAMPLES IN SB20 DIL PACKAGE

2

1

20

3

4

5

6

7

8

9

10

19

18

17

16

15

14

13

12

11

VC

VSS

X2

CLK

PV

VDD

Top marking:

YYWW = Year, Week

XXXXX.X = Lot number

TE1

DA

X1

OUT

TE2

MAS9279

VDD

PV

CLK

DA

TE1

X2

VC

X1

OUT

VSS

TE2

1506um

2202um

Die map reference

MAS9279

VDD

PV

CLK

DA

TE1

X2

VC

X1

OUT

VSS

TE2

1506um

2202um

Die map reference