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RT7208EB Datasheet(PDF) 4 Page - Richtek Technology Corporation |
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RT7208EB Datasheet(HTML) 4 Page - Richtek Technology Corporation |
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4 / 51 page  RT7208EB r Copyright © 2021 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation. www.richtek.com DS7208EB-00 August 2021 4 Functional Pin Description Pin No. Pin Name Type Pin Function 1 V_TR AI Transformer voltage sense node. 2 CS+ AI Positive input of a current-sense amplifier for output current sensing. 3 CS- AI Negative input of a current-sense amplifier for output current sensing. 4 D- A/D IO USB D- channel. 5 D+ A/D IO USB D+ channel. 6 CC1 A/D IO Type-C connector Configuration Channel (CC) 1, used to detect a cable plug event and determine the cable orientation. 7 CC2 A/D IO Type-C connector Configuration Channel (CC) 2, used to detect a cable plug event and determine the cable orientation. 8 CC_GND GND Alternative ground for CC1 and CC2. 9 RT2 A/D IO Remote thermal sensor connection node 2 for over-temperature protection. 10 RT1 A/D IO Remote thermal sensor connection node 1 for over-temperature protection. 11 VCONN PWR Supply VCONN power to CC1/CC2. 12 SYNC A IO Bi-direction control for pulse transformer connection. 13 SGND GND Alternative ground for SYNC. 14 AGND GND Analog ground. 15 VBUS D IO VBUS sensing and bleeder connection node to provide another path to discharge the VBUS capacitor. 16 USBP D IO Control signal of the blocking N-MOSFET 17 NC NC No internal connection. 18, 19 VDD PWR Supply input voltage. 20 AGND GND Analog ground. 21 V2 PWR Regulated DC bias to supply for the MCU. 22 V5 PWR Regulated DC bias to supply for internal circuitry. 23 VCN AO Charge pump driver CN output. 24 VCP AO Charge pump driver CP output. 25 V9 PWR Regulated DC bias to supply for the synchronous rectifier driver. 26 VG AO Gate driver output for the SR MOSFET. 27 PGND GND Power ground. 28 BLD D IO Bleeder connection node to provide another path to discharge the output capacitor. 29 (Exposed Pad) GND GND Power ground. The exposed pad must be connected to GND and well soldered to a large PCB copper area for maximum power dissipation. |
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