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TMUX8109 Datasheet(PDF) 4 Page - Texas Instruments

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Part # TMUX8109
Description  TMUX810x 100-V, Flat RON, Single 8:1 and Dual 4:1 Multiplexers with Latch-Up Immunity and 1.8-V Logic
PDF  43 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TMUX8109 Datasheet(HTML) 4 Page - Texas Instruments

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1
A0
16
A1
2
EN
15
GND
3
VSS
14
VDD
4
S1A
13
S1B
5
S2A
12
S2B
6
S3A
11
S3B
7
S4A
10
S4B
8
DA
9
DB
Not to scale
Figure 6-3. PW Package, 16-Pin TSSOP (Top View)
1
VSS
12
VDD
2
S1A
11
S1B
3
S2A
10
S2B
4
S3A
9
S3B
Not to scale
Thermal
Pad
Figure 6-4. RUM Package, 16-Pin WQFN (Top View)
Table 6-2. Pin Functions: TMUX8109
PIN
TYPE(1)
DESCRIPTION
NAME
TSSOP
WQFN
A0
1
15
I
Logic control input address 0 (A0).
EN
2
16
I
Active high digital enable (EN) pin. The device is disabled and all switches become high impedance when
the pin is low. When the pin is high, the Ax logic inputs determine individual switch states.
VSS
3
1
P
Negative power supply. This pin is the most negative power-supply potential. In single-supply
applications, this pin can be connected to ground. For reliable operation, connect a decoupling capacitor
ranging from 0.1 µF to 10 µF between VSS and GND.
S1A
4
2
I/O
Source pin 1A. Can be an input or output.
S2A
5
3
I/O
Source pin 2A. Can be an input or output.
S3A
6
4
I/O
Source pin 3A. Can be an input or output.
S4A
7
5
I/O
Source pin 4A. Can be an input or output.
DA
8
6
I/O
Drain terminal A. Can be an input or output.
DB
9
7
I/O
Drain terminal B. Can be an input or output
S4B
10
8
I/O
Source pin 4B. Can be an input or output.
S3B
11
9
I/O
Source pin 3B. Can be an input or output.
S2B
12
10
I/O
Source pin 2B. Can be an input or output.
S1B
13
11
I/O
Source pin 1B. Can be an input or output.
VDD
14
12
P
Positive power supply. This pin is the most positive power-supply potential. For reliable operation, connect
a decoupling capacitor ranging from 0.1 µF to 10 µF between VDD and GND.
GND
15
13
P
Ground (0 V) reference
A1
16
14
I
Logic control input address 1 (A1).
Thermal Pad
—
The thermal pad is not connected internally. It is recommended to tie the pad to GND or VSS for the best
performance.
(1)
I = input, O = output, I/O = input and output, P = power
TMUX8108, TMUX8109
SCDS435B – SEPTEMBER 2021 – REVISED AUGUST 2023
www.ti.com
4
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Copyright © 2023 Texas Instruments Incorporated
Product Folder Links: TMUX8108 TMUX8109



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