7.3 Recommended Operating Conditions: TMUX810x Devices

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VDD – VSS (1) Power supply voltage differential

10

100

V

VDD

Positive power supply voltage

10

100

V

VS or VD (2)

Signal path input/output voltage (source or drain pin)

VSS

VDD

V

VA or VEN

Address or enable pin voltage

0

48

V

TA

Ambient temperature

–40

125

°C

VS or VD (2)

Signal path input/output voltage (source or drain pin)

VSS

VDD

V

TA

Ambient temperature

–40

125

°C

IDC 1ch.(3)

Continuous current through switch for TSSOP or QFN on 1 channel

100

mA

IDC All ch.(4)

Continuous current through switch on all channels at the

same time, TSSOP package

TA = 25°C

75

mA

TA = 85°C

50

mA

TA = 125°C

25

mA

(1)

VDD and VSS can be any value as long as 10 V ≤ (VDD – VSS) ≤ 100 V, and the minimum VDD is met.

(2)

VS or VD is the voltage on any Source or Drain pins.

(3)

Max continuous current shown for a single channel at a time.

(4)

Max continuous current shown for all channels at a time. Refer to the maximum power dissipation (Ptot) so that the package limitations

are not violated.

7.4 Thermal Information

THERMAL METRIC(1)

TMUX8108

TMUX8109

TMUX8108

TMUX8109

UNIT

PW (TSSOP)

PW (TSSOP)

RUM (QFN)

16 PINS

16 PINS

16 PINS

RθJA

Junction-to-ambient thermal resistance

97.0

96.4

41.9

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

26.7

26.5

25.8

°C/W

RθJB

Junction-to-board thermal resistance

43.8

43.1

17.0

°C/W

ΨJT

Junction-to-top characterization parameter

1.1

1.1

0.3

°C/W

ΨJB

Junction-to-board characterization parameter

43.1

42.5

17.0

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

3.2

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

TMUX8108, TMUX8109

SCDS435B – SEPTEMBER 2021 – REVISED AUGUST 2023

www.ti.com

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