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32G431 Datasheet(PDF) 174 Page - STMicroelectronics |
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32G431 Datasheet(HTML) 174 Page - STMicroelectronics |
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174 / 198 page ![]() Package information STM32G431x6 STM32G431x8 STM32G431xB 174/198 DS12589 Rev 6 6.5 WLCSP49 package information This WLCSP49 is a 49-ball, 3.15 x 3.13 mm, 0.4 mm pitch, wafer level chip scale package. Figure 52. WLCSP49 - Outline 1. Drawing is not to scale. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. B03Q_WLCSP49_DIE468_ME_V1 F G e1 e2 e e A1 ORIENTATION REFERENCE E D A1 A A2 DETAIL A aaa bbb Z (4x) A3 BOTTOM VIEW A2 b FRONT VIEW TOP VIEW SIDE VIEW DETAIL A ROTATED 90 eee Z BUMP Z b(49x) ccc Z X Y ddd Z A1 SEATING PLANE |
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