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EL1507CSZ Datasheet(PDF) 12 Page - Intersil Corporation |
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EL1507CSZ Datasheet(HTML) 12 Page - Intersil Corporation |
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12 / 16 page ![]() 12 FN7013.3 March 26, 2007 FIGURE 47. OFFSET VOLTAGE vs TEMPERATURE FIGURE 48. TRANSIMPEDANCE vs TEMPERATURE FIGURE 49. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE FIGURE 50. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE Typical Performance Curves 10 -2 6 2 0 4 8 TEMPERATURE (°C) -50 100 150 -25 0 50 125 25 75 3.5 0 2 3 1 0.5 1.5 2.5 TEMPERATURE (°C) -50 100 150 -25 0 50 125 25 75 833mW θJA=150°C/W QFN16 1.136W θJA=110°C/W SO16 1.2 1 0.8 0.6 0.2 0 0 255075 100 150 AMBIENT TEMPERATURE (°C) 125 85 JEDEC JESD51-3 LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 0.4 JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD - QFN EXPOSED DIEPAD SOLDERED TO PCB PER JESD51-5 4.5 4 3 2 1 0.5 0 0 255075 100 150 AMBIENT TEMPERATURE (°C) 125 85 1.563W θJA=80°C/W SO16 3.5 2.5 1.5 3.125W θJA=40°C/W QFN16 EL1507 |
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