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PACKAGE OUTLINE

C

4X

0.25

0.17

4X

0.30

0.22

0.40 MAX

0.05

0.00

2X 0.6

0.25

TYP

+0.05

-0.03

0.4

B

1.05

0.95

A

0.85

0.75

(0.1) TYP

(0.1)

(0.08)

(0.027) TYP

X2SON - 0.4 mm max height

DTQ0006A

PLASTIC SMALL OUTLINE - NO LEAD

4224056/A 11/2017

PIN 1 INDEX AREA

SEATING PLANE

0.05 C

1

3

4

0.1

C A B

0.05

C

5

NOTE 5

(OPTIONAL)

PIN 1 ID

2

6

PKG

PKG

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pads must be soldered to the printed circuit board for optimal thermal and mechanical performance.

4. The size and shape of this feature may vary.

5. Features may not exist. Recommend use of pin 1 marking on top of package for orientation purposes.

SCALE 12.000