AD5734R datasheet(18/20 Pages) AD

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AD5726

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OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-150-AC

6.50

6.20

5.90

8.20

7.80

7.40

5.60

5.30

5.00

SEATING

PLANE

0.05 MIN

0.65 BSC

2.00 MAX

0.38

0.22

COPLANARITY

0.10

1.85

1.75

1.65

0.25

0.09

0.95

0.75

0.55

8°

4°

0°

Figure 32. 16-Lead Shrink Small Outline Package [SSOP]

(RS-16)

Dimensions shown in millimeters

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

COMPLIANT TO JEDEC STANDARDS MS-013- AA

10.50 (0.4134)

10.10 (0.3976)

0.30 (0.0118)

0.10 (0.0039)

2.65 (0.1043)

2.35 (0.0925)

10.65 (0.4193)

10.00 (0.3937)

7.60 (0.2992)

7.40 (0.2913)

0.75 (0.0295)

0.25 (0.0098)

45°

1.27 (0.0500)

0.40 (0.0157)

COPLANARITY

0.10

0.33 (0.0130)

0.20 (0.0079)

0.51 (0.0201)

0.31 (0.0122)

SEATING

PLANE

8°

0°

1.27 (0.0500)

BSC

Figure 33. 16-Lead Standard Small Outline Package [SOIC_W]

Wide Body

(RW-16)

Dimensions shown in millimeters and (inches)

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

AD5726YRSZ-500RL71

−40°C to +125°C

16-Lead SSOP

RS-16

AD5726YRSZ-REEL1

−40°C to +125°C

16-Lead SSOP

RS-16

AD5726YRWZ-REEL1

−40°C to +125°C

16-Lead SOIC_W

RW-16

AD5726YRWZ-REEL71

−40°C to +125°C

16-Lead SOIC_W

RW-16

1 Z = RoHS Compliant Part.

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