M68HC08 datasheet(101/124 Pages) FREESCALE

101 / 124 page

MC68HC05C9A Advance Information Data Sheet, Rev. 5.1

Freescale Semiconductor

101

Chapter 13

Mechanical Specifications

13.1 Introduction

This section describes the dimensions of the plastic dual in-line package (DIP), plastic shrink dual in-line

package (SDIP), plastic-leaded chip carrier (PLCC), and quad flat pack (QFP) MCU packages.

Package dimensions available at the time of this publication are provided in this section.

To make sure that you have the latest case outline specifications, contact one of the following:

•

Local Freescale Sales Office

•

World Wide Web at http://www.freescale.com

Follow World Wide Web on-line instructions to retrieve the current mechanical specifications.

13.2 40-Pin Plastic Dual In-Line (DIP) Package (Case 711-03)

Figure 13-1. 40-Pin Plastic DIP Package (Case 711-03)

120

SEATING

PLANE

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

51.69

52.45

2.035

2.065

13.72

14.22

0.540

0.560

3.94

5.08

0.155

0.200

0.36

0.56

0.014

0.022

1.02

1.52

0.040

0.060

2.54 BSC

0.100 BSC

1.65

2.16

0.065

0.085

0.20

0.38

0.008

0.015

2.92

3.43

0.115

0.135

15.24 BSC

0.600 BSC

0.51

1.02

0.020

0.040

NOTES:

1. POSITION TOLERANCE OF LEADS (D), SHALL

BEWITHIN 0.25 (0.010) AT MAXIMUM MATERIAL

CONDITIONS, IN RELATION TO SEATING PLANE

AND EACH OTHER.

2. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

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