11

LT1086 Series

sn1086 1086ffs

In both cases the junction temperature is below the

maximum rating for the respective sections, ensuring

reliable operation.

Junction-to-case thermal resistance for the K and T pack-

ages is specified from the IC junction to the bottom of the

case directly below the die. This is the lowest resistance

path for heat flow. While this is also the lowest resistance

path for the H package, most available heat sinks for this

package are of the clip-on type that attach to the cap of the

package. The data sheet specification for thermal resis-

tance for the H package is therefore written to reflect this.

SCSI-2 Active Termination

5V, 1.5A Regulator

10

µF

TANTALUM

4.25V

TO 5.25V

1N5817

TERMPWR

LT1086 • TA03

10

µF

TANTALUM

0.1

µF

CERAMIC

18 TOTAL

110

Ω

2%

110

Ω

110

Ω

110

Ω

110

Ω

2%

110

Ω

2%

LT1086-2.85

IN

OUT

GND

+

+

5V AT 1.5A

*REQUIRED FOR STABILITY

LT1086

LT1086 • AI02

10

µF*

TANTALUM

121

Ω

1%

365

Ω

1%

10

µF

IN

OUT

ADJ

+

+

In all cases proper mounting is required to ensure the best

possible heat flow from the die to the heat sink. Thermal

compound at the case-to-heat sink interface is strongly

recommended. In the case of the H package, mounting the

device so that heat can flow out the bottom of the case will

significantly lower thermal resistance (

≈ a factor of 2). If

the case of the device must be electrically isolated, a

thermally conductive spacer can be used as long as its

added contribution to thermal resistance is considered.

Note that the case of all devices in this series is electrically

connected to the output.