19

LT1168

1168fa

N8 Package

8-Lead PDIP (Narrow 0.300)

(LTC DWG # 05-08-1510)

Dimensions in inches (millimeters) unless otherwise noted.

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

PACKAGE DESCRIPTIO

S8 Package

8-Lead Plastic Small Outline (Narrow 0.150)

(LTC DWG # 05-08-1610)

N8 1002

.065

(1.651)

TYP

.045 – .065

(1.143 – 1.651)

.130

± .005

(3.302

± 0.127)

.020

(0.508)

MIN

.018

± .003

(0.457

± 0.076)

.120

(3.048)

MIN

12

3

4

87

6

5

.255

± .015*

(6.477

± 0.381)

.400*

(10.160)

MAX

.008 – .015

(0.203 – 0.381)

.300 – .325

(7.620 – 8.255)

.325

+.035

–.015

+0.889

–0.381

8.255

()

NOTE:

1. DIMENSIONS ARE

INCHES

MILLIMETERS

*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.

MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)

.100

(2.54)

BSC

.016 – .050

(0.406 – 1.270)

.010 – .020

(0.254 – 0.508)

× 45°

0

°– 8° TYP

.008 – .010

(0.203 – 0.254)

SO8 0303

.053 – .069

(1.346 – 1.752)

.014 – .019

(0.355 – 0.483)

TYP

.004 – .010

(0.101 – 0.254)

.050

(1.270)

BSC

1

2

3

4

.150 – .157

(3.810 – 3.988)

NOTE 3

8

7

6

5

.189 – .197

(4.801 – 5.004)

NOTE 3

.228 – .244

(5.791 – 6.197)

.245

MIN

.160

±.005

RECOMMENDED SOLDER PAD LAYOUT

.045

±.005

.050 BSC

.030

±.005

TYP

INCHES

(MILLIMETERS)

NOTE:

1. DIMENSIONS IN

2. DRAWING NOT TO SCALE

3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.

MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)