11

LT3014B

3014bf

DD Package

8-Lead Plastic DFN (3mm

× 3mm)

(Reference LTC DWG # 05-08-1698)

3.00

±0.10

(4 SIDES)

NOTE:

1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON TOP AND BOTTOM OF PACKAGE

0.38

± 0.10

BOTTOM VIEW—EXPOSED PAD

1.65

± 0.10

(2 SIDES)

0.75

±0.05

R = 0.115

TYP

2.38

±0.10

(2 SIDES)

1

4

8

5

PIN 1

TOP MARK

(NOTE 6)

0.200 REF

0.00 – 0.05

(DD8) DFN 1203

0.25

± 0.05

2.38

±0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

1.65

±0.05

(2 SIDES)

2.15

±0.05

0.50

BSC

0.675

±0.05

3.5

±0.05

PACKAGE

OUTLINE

0.25

± 0.05

0.50 BSC

PACKAGE DESCRIPTIO

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

S5 Package

5-Lead Plastic TSOT-23

(Reference LTC DWG # 05-08-1635)

1.50 – 1.75

(NOTE 4)

2.80 BSC

0.30 – 0.45 TYP

5 PLCS (NOTE 3)

DATUM ‘A’

0.09 – 0.20

(NOTE 3)

S5 TSOT-23 0302

PIN ONE

2.90 BSC

(NOTE 4)

0.95 BSC

1.90 BSC

0.80 – 0.90

1.00 MAX

0.01 – 0.10

0.20 BSC

0.30 – 0.50 REF

NOTE:

1. DIMENSIONS ARE IN MILLIMETERS

2. DRAWING NOT TO SCALE

3. DIMENSIONS ARE INCLUSIVE OF PLATING

4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR

5. MOLD FLASH SHALL NOT EXCEED 0.254mm

6. JEDEC PACKAGE REFERENCE IS MO-193

3.85 MAX

0.62

MAX

0.95

REF

RECOMMENDED SOLDER PAD LAYOUT

PER IPC CALCULATOR

1.4 MIN

2.62 REF

1.22 REF