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TDA1561 Datasheet(PDF) 7 Page - NXP Semiconductors

Part # TDA1561
Description  2 x 23 W high efficiency car radio power amplifier
PDF  24 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

TDA1561 Datasheet(HTML) 7 Page - NXP Semiconductors

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1997 Aug 14
7
Philips Semiconductors
Preliminary specification
2
× 23 W high efficiency car radio power
amplifier
TDA1561Q
Heatsink design
There are two parameters that determine the size of the
heatsink. The first is the rating for the virtual junction
temperature and the second is the ambient temperature at
which the amplifier must still deliver its full power in the
BTL mode.
With a conventional BTL amplifier, the maximum power
dissipation with a music-like signal (at each amplifier) will
be approximately two times 5 W. At a virtual junction
temperature of 150
°C and a maximum ambient
temperature of 60
°C, R
th(vj-c) = 1.3 K/W and
Rth(c-h) = 0.2 K/W, the thermal resistance of the heatsink
should be:
Compared to a conventional BTL amplifier, the TDA1561Q
has a higher efficiency. The thermal resistance of the
heatsink should be:
150
60
–
25
×
----------------------
1.3
–
0.2
–
7.5 K/W
=
1.7
150
60
–
25
×
----------------------


1.3
–
0.2
–
13.8 K/W
=
Fig.3 Thermal equivalent resistance network.
handbook, halfpage
3.6 K/W
0.6 K/W
3.6 K/W
virtual junction
OUT 1
OUT 1
case
3.6 K/W
0.6 K/W
3.6 K/W
OUT 2
OUT 2
MGC424
0.1 K/W



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