AMIS-710600-A8: 600dpi CIS Module

Data Sheet

1.0 General Description

The AMIS-710600-A8 (PI600MC-A8) is a contact image sensor (CIS) module. It is a short version within a family of contact image

sensor modules. It consists of image sensor chips, AMIS-720639 (PI3039), which are also a product of AMIS. This AMIS-720639

sensor chip is a linear array image sensor chip with a 600 elements per inch resolution. Fabricated with AMI Semiconductor’s

proprietary CMOS image sensing technology, these sensors are bonded on a printed circuit board (PCB) to produce the AMIS-710600-

A8 CIS modules. Using the chip-on-board technology, seven sensor chips are bonded to the PCB, forming a linear array module of

57mm, with a total of 1344 pixel elements. This 57mm active read length lends itself to scanning A8 size documents with 23.62 dots per

millimeter (dpm) resolution. This short array length module was especially designed for applications in card scanners but it is not limited

to this specific application. It can be used in various mark readers and other automation equipment requiring narrow scanning modules.

2.0 Key Features

• Light source, lens and sensor are integrated into a single module

• 23.62dpm resolution, 57mm scanning length

• Up to 390µsec/line scanning speed, with 3.5MHz pixel rate

• Wide dynamic range

• Analog output

• Yellow-Green LED light source

• Compact size ≅ 12mm x 15mm x 70mm

• Low power

• Light weight

3.0 Functional Description

As described in the previous section, the AMIS-710600-A8 imaging array consists of seven image sensors. Each solid-state sensor

contains an integrated array of photo-detectors with their associated multiplex switches and a digital shift register, to sequentially

readout each video pixel from its photo-detector. Seven of these integrated array sensors are bonded on the PCB and sequentially

cascaded to form a CIS line array of 1344 pixel elements. Since each sensor has I/O pads for the shift register start pulse ( SP) and the

end-of-scan pulse (EOS); each preceding sensor’s EOS in the sequence loads into the following sensor’s SP, providing for a

continuously scanning array each time the first sensor’s SP in the sequence is loaded. These sequential video pixels from each sensor

are summed on to a common video line, which terminates into a common buffer amplifier. The output of the amplifier produces the

output video pixels from the module (see Figure 1).

The PCB is enclosed in the module housing along with its associated electro-optical components, to form a self-contained imaging

system. Its array sensors are optically aligned and mounted along with a one-to-one graded indexed micro lens array, which focuses

the image from the scanned documents onto the sensing plane of its array. Its light source is specially fabricated and aligned with the

micro lens and its document to form a completely integral CIS imaging system.

The enclosed module has a cover glass with its surface near or on the focal point for the object being scanned, while it serves to protect

the imaging sensors, the micro lens assembly and the LED light source from contaminants in the environment, such as dust. The I/O to

the module is a 10-pin connector located on one end of the module. Figure 2 shows a cross section of the AMIS-710600-A8.

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AMI Semiconductor – July. 06, M-20597-001

www.amis.com