4 Pin Configuration and Functions

1

NULL

8

NULL

2

IN-

7

VCC+

3

IN+

6

OUT

4

VCC-

5

NC

Not to scale

Figure 4-1. OPA892: D Package, 8-Pin SOIC (Top View)

Table 4-1. Pin Functions: OPA892

PIN

TYPE

DESCRIPTION

NAME

NO.

IN–

2

Input

Inverting input

IN+

3

Input

Noninverting input

NC

5

—

No connection

NULL

1, 8

Input

Voltage offset adjust

OUT

6

Output

Output of amplifier

VCC–

4

—

Negative power supply

VCC+

7

—

Positive power supply

1

1OUT

8

VCC+

2

1IN-

7

2OUT

3

1IN+

6

2IN-

4

VCC-

5

2IN+

Not to scale

Figure 4-2. OPA2892: DGN Package, 8-pin HVSSOP (Top View)

Table 4-2. Pin Functions: OPA2892

PIN

TYPE

DESCRIPTION

NAME

NO.

1IN–

2

Input

Channel 1 inverting input

1IN+

3

Input

Channel 1 noninverting input

1OUT

1

Output

Channel 1 output

2IN–

6

Input

Channel 2 inverting input

2IN+

5

Input

Channel 2 noninverting input

2OUT

7

Output

Channel 2 output

VCC–

4

—

Negative power supply

VCC+

8

—

Positive power supply

Thermal pad

—

Thermal pad. DGN (HVSSOP) package only. For best thermal performance, connect pad to

large copper plane. Thermal pad can be connected to any pin on the device, or any other

potential on the board if voltage on thermal pad remains between VCC+ and VCC–.

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OPA892, OPA2892

SLOSEB4A – NOVEMBER 2023 – REVISED JULY 2024

Copyright © 2024 Texas Instruments Incorporated

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