8 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,

generate code, and develop solutions are listed below.

8.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

8.2 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

8.3 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

8.4 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

8.5 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

9 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision G (May 2022) to Revision H (August 2024)

Page

• Added DGS package to Device Information table, Pin Configuration and Functions section, and Thermal

Information table.................................................................................................................................................1

• Added Pin Functions table..................................................................................................................................3

• Added Application and Implementation section..................................................................................................8

Changes from Revision F (February 2022) to Revision G (May 2022)

Page

• Junction-to-ambient thermal resistance values increased. DW was 58 is now 109.1, N was 69 is now 84.6,

NS was 60 is now 113.4, PW was 83 is now 131.8............................................................................................4

10 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

www.ti.com

SN54HCT240, SN74HCT240

SCLS174H – MARCH 1984 – REVISED AUGUST 2024

Copyright © 2024 Texas Instruments Incorporated

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Product Folder Links: SN54HCT240 SN74HCT240