TDA8512 datasheet(2/24 Pages) PHILIPS

2 / 24 page

2001 Nov 16

Philips Semiconductors

Preliminary speciﬁcation

26 W BTL and 2

× 13 W SE or

× 13 W SE power ampliﬁer

TDA8512J

CONTENTS

FEATURES

APPLICATIONS

GENERAL DESCRIPTION

QUICK REFERENCE DATA

ORDERING INFORMATION

BLOCK DIAGRAM

PINNING

FUNCTIONAL DESCRIPTION

8.1

Mode select switch

8.2

Mode select

8.3

Built-in protection circuits

8.4

Short-circuit protection

LIMITING VALUES

HANDLING

THERMAL CHARACTERISTICS

DC CHARACTERISTICS

AC CHARACTERISTICS

APPLICATION INFORMATION

14.1

Input configuration

14.2

Output power

14.3

Power dissipation

14.4

Supply Voltage Ripple Rejection (SVRR)

14.5

Switch-on and switch-off

14.6

PCB layout and grounding

14.7

Typical performance characteristics

PACKAGE OUTLINE

SOLDERING

16.1

Introduction to soldering through-hole mount

packages

16.2

Soldering by dipping or by solder wave

16.3

Manual soldering

16.4

Suitability of through-hole mount IC packages

for dipping and wave soldering methods

DATA SHEET STATUS

DEFINITIONS

DISCLAIMERS

TDA8512 Datasheet(PDF) 2 Page - NXP Semiconductors

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