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LT1210X

1210Xfa

For more information www.linear.com/LT1210X

APPLICATIONS INFORMATION

For operation at 175°C ambient, extreme care must be

taken to not exceed a junction temperature of 200°C.

Large amounts of thermal plane area should be used.

Furthermore, power supply voltages should be reduced

as much as possible (down to a minimum of ±5V), the

value of Rload should be increased as much as possible,

and ISUPPLY of the LT1210X should be reduced as much

as possible by using the CURRENT SET feature of the

LT1210X.

For example, by using a thermal plane area much larger

than Example A in Table 1, it is reasonable to achieve a θJA

TOP LAYER A

TOP LAYER B

TOP LAYER C

TOP LAYER D

EXAMPLE A

EXAMPLE B

EXAMPLE C

EXAMPLE D

BOTTOM LAYER A

JA = 90°C/W

JC = 10°C/W

CA = 80°C/W

JA = 100°C/W

JC = 10°C/W

CA = 90°C/W

JA = 108°C/W

JC = 10°C/W

CA = 98°C/W

JA = 115°C/W

JC = 10°C/W

CA = 105°C/W

BOTTOM LAYER B

BOTTOM LAYER C

BOTTOM LAYER D

Table 1. Thermal Resistance vs PCB Thermal Plane Area

1210X TABLE 1

of 50°C/W. By reducing supply voltages to ±5V, lowering

ISUPPLY with RSD = 15kΩ and using a 25 load, maxi-

mum ambient temperature can be increased substantially.

Assuming θJA can be reduced to 50°C/W and ISUPPLY can

be reduced to 25mA:

tRISE = (50°C/W) • [(10V • 25mA) + ((10V/4)^2)/25]

= (50°C/W) • [0.25W +0.25W] = 25°C

This combination of techniques allows the LT1210X to

operate continuously at an ambient temperature of 175°

with a maximum junction temperature of 200°C.

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