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TDA8766 Datasheet(PDF) 8 Page - NXP Semiconductors

Part # TDA8766
Description  10-bit high-speed 2.7 to 5.25 V analog-to-digital converter
PDF  20 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

TDA8766 Datasheet(HTML) 8 Page - NXP Semiconductors

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1996 Mar 20
8
Philips Semiconductors
Product specification
10-bit high-speed 2.7 to 5.25 V
analog-to-digital converter
TDA8766
Notes
1. In addition to a good layout of the digital and analog ground, it is recommended that the rise and fall times of the clock
must not be less than 1 ns.
2. Analog input voltages producing code 0 up to and including 1023:
a) VosB (voltage offset BOTTOM) is the difference between the analog input which produces data equal to 00 and
the reference voltage BOTTOM (VRB) at Tamb =25 °C.
b) VosT (voltage offset TOP) is the difference between VRT (reference voltage TOP) and the analog input which
produces data outputs equal to 1023 at Tamb =25 °C.
3. In order to ensure the optimum linearity performance of such converter architecture the lower and upper extremities
of the converter reference resistor ladder (corresponding to output codes 0 and 1023 respectively) are connected to
pins VRB and VRT via offset resistors ROB and ROT as shown in Fig.3.
a) The current flowing into the resistor ladder is IL =
and the full-scale input range at the converter,
to cover code 0 to code 1023, is
b) Since RL, ROB and ROT have similar behaviour with respect to process and temperature variation, the ratio
will be kept reasonably constant from part to part. Consequently variation of the output codes
at a given input voltage depends mainly on the difference VRT − VRB and its variation with temperature and supply
voltage. When several ADCs are connected in parallel and fed with the same reference source, the matching
between each of them is then optimized.
EFFECTIVE BITS; see Fig.9; note 5
EB
effective bits
fclk = 20 MHz
fi = 300 kHz
−
9.5
−
bits
fi = 1 MHz
−
9.3
−
bits
fi = 3.58 MHz
−
8.0
−
bits
Timing (fclk = 20 MHz; CL = 20 pF); see Fig.4; note 6
tds
sampling delay time
−−
5ns
th
output hold time
5
−−
ns
td
output delay time
VDDO = 4.75 V
8
12
15
ns
VDDO = 3.15 V
8
17
20
ns
VDDO = 2.7 V
8
21
24
ns
3-state output delay times; see Fig.5
tdZH
enable HIGH
−
14
18
ns
tdZL
enable LOW
−
16
20
ns
tdHZ
disable HIGH
−
16
20
ns
tdLZ
disable LOW
−
14
18
ns
Standby mode output delay times
tdSTBLH
standby (LOW-to-HIGH transition)
−−
200
ns
tdSTBHL
start-up (HIGH-to-LOW transition)
−−
500
ns
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
RT
V
RB
–
R
OB
R
L
R
OT
++
------------------------------------------
V
I
R
L
I
L
×
R
L
R
OB
R
L
R
OT
++
------------------------------------------
V
RT
V
RB
–
()
0.871
V
RT
V
RB
–
()
×
=
×
=
=
R
L
R
OB
R
L
R
OT
++
-----------------------------------------



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