DS26303 datasheet(79/101 Pages) DALLAS

Part #	DS26303

Description	3.3V, E1/T1/J1, Short-Haul, Octal Line Interface Unit

PDF	101 Pages

Scroll/Zoom	100%

Manufacturer	DALLAS [Dallas Semiconductor]

Direct Link	https://www.maximintegrated.com/en.html

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79 / 101 page

DS26303: 3.3V, T1/E1/J1, Short-Haul, Octal Line Interface Unit

79 of 101

9 THERMAL CHARACTERISTICS

Table 9-1. Thermal Characteristics

PARAMETER

MIN

TYP

MAX

UNITS

Power Dissipation with RIMPMS = 0 (Notes 1, 2)

0.7

1.40

Power Dissipation with RIMPMS = 1(Notes 1, 2)

0.9

1.65

Ambient Temperature (Note 3)

-40

+85

°C

Junction Temperature

+125

°C

+21.3

(Note 4)

Theta-JA (

θJA) in Still Air for 144-Pin LQFP with Exposed Pad

29.0

(Note 5)

°C/W

Note 1:

RCLK1-n = TCLK1-n = 1.544MHz.

Note 2:

Power dissipation with all ports active, TTIP and TRIN driving a 25

Ω load, for an all-ones data density.

Note 3:

The package is mounted on a four-layer JEDEC standard test board.

Note 4:

Theta-JA (

θJA) is the junction-to-ambient thermal resistance, when the package is mounted on a four-layer JEDEC standard test

board and the die attach pad is soldered to the test board.

Note 5:

Theta-JA (

θJA) is the junction-to-ambient thermal resistance, when the package is mounted on a four-layer JEDEC standard test

board and the die attach pad is not soldered to the test board.

DS26303 Datasheet(PDF) 79 Page - Dallas Semiconductor

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