AD8016 datasheet(19/20 Pages) AD

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Data Sheet

AD8016

Rev. C | Page 19 of 20

EXPERIMENTAL RESULTS

The experimental data suggests that for both packages, and

a PCB as small as 4.7 square inches, reasonable junction

temperatures can be maintained even in the absence of air

flow. The graph in Figure 47 shows junction temperature vs.

airflow for various dimensions of 1 oz. copper PCBs at an

ambient temperature of 24°C in the ARB package. For the

worst-case package, the AD8016 ARB and the worst-case

PCB at 4.7 square inches, the extrapolated junction temperature

for an ambient environment of 85°C would be approximately

132°C with 0 LFM of airflow. If the target maximum junction

temperature of the AD8016 ARB is 125°C, a 4-layer PCB with

1 oz. copper covering the outer layers and measuring 9 square

inches is required with 0 LFM of air flow.

Note that the AD8016 ARE is targeted at xDSL applications

other than full-rate CO ADSL. The AD8016 ARE is targeted

at g.lite and other xDSL applications where reduced power

dissipation can be achieved through a reduction in output

power. Extreme temperatures associated with full-rate ADSL

using the AD8016 ARE should be avoided whenever possible.

Figure 47. Junction Temperature vs. Air Flow

Figure 48. Junction-to-Ambient Thermal Resistance vs. PCB Area

Figure 49. Junction-to-Ambient Thermal Resistance vs. PCB Area

AIR FLOW (LFM)

200

150

100

ARB 4.7 SQ-IN

ARB 7.125 SQ-IN

ARB 9 SQ-IN

ARB 6 SQ-IN

+24°C AMBIENT

PCB AREA (SQ-IN)

ARB 0 LFM

ARB 50 LFM

ARB 100 LFM

ARB 200 LFM

ARB 150 LFM

PCB AREA (SQ-IN)

ARE 0 LFM

ARE 200 LFM

ARE 400 LFM

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