AD8016

Data Sheet

Rev. C | Page 20 of 20

OUTLINE DIMENSIONS

Figure 50. 24-Lead Batwing SOIC, Thermally Enhanced w/Fused Leads [SOIC_W_BAT]

(RB-24)

Dimensions shown in millimeters

Figure 51. 28-Lead Thin Shrink Small Outline With Exposed Pad [TSSOP_EP]

(RE-28-1)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

AD8016ARBZ

−40°C to +85°C

24-Lead SOIC_W_BAT

RB-24

AD8016ARBZ-REEL

−40°C to +85°C

24-Lead SOIC_W_BAT

RB-24

AD8016AREZ

−40°C to +85°C

28-Lead TSSOP_EP

RE-28-1

AD8016AREZ-REEL

−40°C to +85°C

28-Lead TSSOP_EP

RE-28-1

AD8016AREZ-REEL7

−40°C to +85°C

28-Lead TSSOP_EP

RE-28-1

1 Z = RoHS Compliant Part.

0.32

0.23

1.27

0.40

8°

0°

0.75

0.25

 45°

24

13

12

1

15.60

15.20

7.60

7.40

PIN 1

10.65

10.00

SEATING

PLANE

0.30

0.10

0.51

0.33

2.65

2.35

1.27

BSC

COMPLIANT WITH JEDEC STANDARDS MS-013-AD

COMPLIANT TO JEDEC STANDARDS MO-153-AET

28

15

14

1

EXPOSED

PAD

(Pins Up)

9.80

9.70

9.60

4.50

4.40

4.30

6.40

BSC

TOP VIEW

BOTTOM VIEW

0.65 BSC

0.15

0.05

COPLANARITY

0.10

1.20 MAX

1.05

1.00

0.80

0.30

0.19

SEATING

PLANE

0.20

0.09

3.05

3.00

2.95

8°

0°

0.75

0.60

0.45

3.55

3.50

3.45

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

©2012 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D01019-0-3/12(C)