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PACKAGE OUTLINE

C

48X

0.27

0.17

44X 0.5

PIN 1 ID

(0.13)

TYP

0.15

0.05

0 -7

4X 5.5

9.2

8.8

TYP

3.62

3.15

0.75

0.45

3.62

3.15

4X (0.25) NOTE 5

B

7.2

6.8

NOTE 3

A

7.2

6.8

NOTE 3

0.25

GAGE PLANE

1.2 MAX

(1)

PowerPAD

HTQFP - 1.2 mm max height

PHP0048E

4226616 /A 02/2021

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.15 mm per side.

4. Reference JEDEC registration MS-026.

5. Feature may not be present.

TM

PowerPAD is a trademark of Texas Instruments.

1

12

13

24

25

36

37

48

0.08

C A B

SEE DETAIL A

SEATING PLANE

0.08

A 16

DETAIL A

TYPICAL

SCALE 1.900

1

12

13

24

25

36

37

48

49